搜索

LIANXISHANGMAO

New Materials, New Science, New Future

NEWS / LIANXI

02/02/2021

Use of o-cresol epoxy resin

Ortho-cresol novolac epoxy resin (EOCN) is a novolac heat-resistant polyfunctional epoxy resin obtained by the reaction of ortho-cresol novolac resin (O-CN) and epichlorohydrin (ECH), which is widely used as Plastic packaging materials for electronic components such as semiconductor equipment and integrated circuits to protect electronic components from environmental corrosion and maintain product performance and service life. Therefore, the resin is required to have good performance and high purity, that is, the content of residual chlorine, sodium ions and hydrolyzable chlorine should be low. With the rapid development of the electronics industry, the demand for (ECH) resin is increasing, and the purity of the product is higher. The lower the content of hydrolyzable chlorine, the better. It can be seen from the molecular structure that each benzene ring is connected with an epoxy group, which is compared with the bisphenol A epoxy resin (epoxy value 0.2eq/100g) with a softening point of 70~80℃. , The epoxy value of o-cresol novolac epoxy resin is as high as 0.5 eq/100g or more. When the resin is cured, it can provide 2.5 times the cross-linking point, and it is easy to form a three-dimensional structure with high cross-linking density. In addition, the cured product is rich in phenolic skeleton. A higher glass transition temperature (tg) with excellent thermal stability, mechanical strength, electrical insulation performance, water resistance, and chemical resistance, see the expression. Electronic components encapsulated by high-purity resin can maintain their good electrical insulation even in high temperature, humidity and harsh environments. Another notable feature of this resin is that when the softening point changes, the epoxy value basically does not change, and the melt viscosity is quite low, which gives the resin excellent process stability and processing technology. Therefore, it is widely used as LSI and VLSI integration in the semiconductor industry. The main bonding material for packaging materials such as circuits, electronic components, and civil weak current products (VTR, OP).
MORE
Use of o-cresol epoxy resin
MORE
Previous page
1
LIANXI

Sales online: 

Add: Room 06,floor 17,building 4,asia Pacific Holiday Garden, Liuquan Road 296,hi-tech Industrial District, Zibo City,shandong Province,china.

Mobile site

- MOBILE SITE -

Copyright © 2020  SHANDONG LIANXI SHANGMAO CO.,LTD.

国际站建设:中企动力 淄博

鲁ICP备2020049706号-3